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INTEGRATED CIRCUITS
DATA SHEET
TZA1046 Photodiode and amplifier IC for CD and DVD applications
Preliminary specification 2004 May 04
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
CONTENTS 1 2 3 4 5 6 7 8 9 10 11 12 12.1 12.2 FEATURES APPLICATIONS GENERAL DESCRIPTION ORDERING INFORMATION QUICK REFERENCE DATA BLOCK DIAGRAM PINNING MODE SELECTION MECHANICAL DATA LIMITING VALUES CHARACTERISTICS APPLICATION AND TEST INFORMATION Application example Test mode description 13 14 14.1 14.2 14.3 14.4 14.5 15 16 17 18 PACKAGE OUTLINE SOLDERING
TZA1046
Introduction to soldering surface mount packages Reflow soldering Wave soldering Manual soldering Suitability of surface mount IC packages for wave and reflow soldering methods ADDITIONAL SOLDERING INFORMATION DATA SHEET STATUS DEFINITIONS DISCLAIMERS
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Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
1 FEATURES
TZA1046
The H/L switch is a three level switch that can be used to adjust the gain for different dye and phase change media. The third level (high-impedance state) invokes the power-down mode for standby condition. Gain switch R/W is used to reduce the gain during writing. During CD-R writing with clipping, the high peak signals for the central and satellite segments are clamped internally and the output currents of the A, B, C, D, E, F, G and H segments are folded back to reduce power consumption. The output currents can be folded back to almost zero, depending on the light power detected. CD-R writing can also be done without clipping for applications where averaging is used. All outputs are current outputs that can supply a maximum of 8 mA. In CD-R write clip mode, the clipping level of the output currents is between 5 mA and 8 mA. The HTSSON16T package has a low spread on the Z tolerance. The Z tolerance is measured between the diodes (chip surface) and the bottom of the leads. The diodes have an offset of 54 m the y direction with respect to the leadframe centre and a tolerance of 50m in both x- and y-directions. In normal operation the satellite outputs F and H are combined as one output FH and the satellite outputs E and G are combined as one output EG. In normal mode the ETST and HTST outputs are not used (high ohmic). When pulling the R/W pin above the supply or is left open the device comes into a testing mode where all four separate satellite channels are directed to the outputs. This mode is used for Optical Pick-up Unit (OPU) alignment of the diodes where all satellite channels must be available.
* High frequency RF amplifiers * Power-down mode for standby condition * Suitable for all CD (785 nm) and DVD (655 nm) read/write applications * Four high-bandwidth central outputs (A, B, C and D); four satellite outputs (EG, FH, ETST and HTST) and one high-bandwidth differential RF output (RFP and RFN) * Internal current clamp and current fold back (power reduction) * Versatile programmable gain switches (CD/DVD, H/L and R/W) * Single 5 V supply * Current outputs for optimum signal transport over flex cable * Small outline package HTSSON16T with good positional tolerance. 2 APPLICATIONS
* CD and DVD read/write applications. 3 GENERAL DESCRIPTION
The TZA1046 is a single optical pick-up IC for read/write systems and is suitable for CD and DVD applications. The device contains eight RF amplifiers for the central and satellite diodes and one differential RF amplifier (RFP and RFN) which handles the sum of the four A, B, C and D central diode signals. Programming the gain is a very versatile way to optimize interfacing between the TZA1046 and the preamplifier. The gain can be programmed for CD or DVD media with the gain switch CD/DVD. 4 ORDERING INFORMATION TYPE NUMBER TZA1046TM
PACKAGE NAME DESCRIPTION VERSION SOT814-1
HTSSON16T plastic thermal enhanced thin shrink small outline package/transparent; no leads; 16 terminals; body 6.6 x 5.2 x 1.1 mm
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Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
5 QUICK REFERENCE DATA SYMBOL Supplies VDD1 VDD2 IDD1 supply voltage front-end supply voltage back-end supply current front-end dark conditions; 6-channel mode writing DVD+R writing CDR clipping writing DVD+RW or CDR no-clip writing CDRW reading DVD reading CD reading DVD+RW reading CDRW power-down mode IDD2 supply current back-end dark conditions; 6-channel mode writing DVD+R writing CDR clipping writing DVD+RW or CDR no-clip writing CDRW reading DVD reading CD reading DVD+RW reading CDRW power-down mode Temperature range Tamb B-3dB(cen) ambient temperature 0 - 70 - - - - - - - - - 5.3 5.3 5.3 5.3 5.3 5.3 5.3 6.6 0.1 - - - - - - - - - - - - - - - - - - 13 27 13 12 27 28 27 27 0.4 - - - - - - - - - 4.5 4.5 5.0 5.0 PARAMETER CONDITIONS MIN. TYP.
TZA1046
MAX.
UNIT
5.5 5.5
V V
mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA C
RF bandwidth bandwidth of central Io = 1.0 mA; 6-channel mode channels A, B, C and D reading DVD reading CD reading DVD+RW reading CDRW B-3dB(RF) bandwidth of differential Io = 1.0 mA channels RFP and RFN reading DVD reading CD reading DVD+RW reading CDRW 130 100 130 80 130 100 130 80 165 142 162 124 175 130 166 114 - - - - - - - - MHz MHz MHz MHz MHz MHz MHz MHz
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Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
SYMBOL Settling time tst settling time CD-R write mode (all channels); Iset > 300 A; accuracy set level within 5 %; write peak level to set level factor < 50 CD-RW and DVD+RW write modes (all channels); Iset > 100 A; accuracy set level within 5 %; write peak level to set level factor 2; peak current Io(max) DVD+R write mode (all channels); Iset > 100 A; accuracy set level within 5 %; write peak level to set level factor 20; peak current Io(max) Phase delay and group delay variation td(p)(RF) phase delay variation differential channels RFP and RFN Io = 1.0 mA; fi = 2 to 104 MHz reading DVD reading CD reading DVD+RW reading CDRW td(g)(RF) group delay variation differential channels RFP and RFN Io = 1.0 mA; fi = 2 to 104 MHz reading DVD reading CD reading DVD+RW reading CDRW Sensitivity s output current sensitivity values depend on operating mode; see Table 1 - - - - - - - 0.4 0.6 0.4 1 - - - - - - - - 0.2 0.3 0.25 0.5 - - - - - - 22 PARAMETER CONDITIONS MIN. TYP.
TZA1046
MAX.
UNIT
ns
-
-
10
ns
-
-
12
ns
ns ns ns ns ns ns ns ns
A/W
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Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
Table 1 Output current sensitivity; typical values
TZA1046
OUTPUT CURRENT SENSITIVITY (A/W)(1) MODE CENTRAL Writing DVD+R with averaging Reading high reflective DVD media: single layer DVD and DVD+R Writing DVD+RW with averaging Reading low reflective DVD media: dual layer DVD and DVD+RW Writing CDR with sampling Reading high reflective CD media Writing CDR with averaging Writing CDRW with averaging Reading low reflective CD media: CDRW Note 1. The sensitivity of the TZA1046 is specified in A/W because it has current outputs. In the application diagram (see Fig.6) the resistors of 150 convert the currents into voltages. The maximum absolute spread is 20 %. 0.72 21.6 2.88 43.2 43.2 86.4 1.44 5.76 173 SATELLITE 1.44 43.2 5.76 86.4 86.4 173 2.88 11.5 346 DIFFERENTIAL (RFP AND RFN) 0.27 8.10 1.08 16.2 1.08 32.4 0.54 2.16 64.8
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Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
6 BLOCK DIAGRAM
TZA1046
handbook, full pagewidth
GND VDD2 VDD1
6 3 14 A
VDD1
VDD2 1 A
VDD1 B
VDD2 7 B
VDD1 C
VDD2 8 C
VDD1 D
VDD2 2 D
VDD1 E
VDD2 16 ETST
VDD1 F
VDD1
VDD2 10 FH
VDD1 G
VDD2 15 EG
VDD1 H
VDD2 9 HTST
VDD2 4 H/L CD/DVD R/W 12 13 11 5 RFN CODER (1) RFP
TZA1046
VDD2
MDB573
(1) The coder translates the three digital inputs into the appropriate gain level of each amplifier. The limiter is switched to a high level for other modes than the CD-R writing mode for all segment outputs.
Fig.1 Block diagram.
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Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
7 PINNING PIN 1 2 3 4 5 6 7 8 9 10 DESCRIPTION central segment output A central segment output D supply voltage back-end positive RF output negative RF output ground central segment output B central segment output C satellite segment output H in test mode; note 1 sum of satellite segment F and segment H output, segment F output in test mode; note 1 gain select switch for reading or writing and to select the test mode gain select switch for low reflective (H/L = 1) and high reflective (H/L = 0) media gain select switch for CD or DVD supply voltage front-end Sum of satellite segment E and segment G output, satellite output G in test mode; note 1 segment E output in test mode; note 1 Fig.2 Pin configuration.
C B GND RFN RFP VDD2 D A 8 7 6 5 4 3 2 1
TZA1046
SYMBOL A D VDD2 RFP RFN GND B C HTST FH
9 10 11 12
HTST FH R/W H/L CD/DVD VDD1 EG ETST
TZA1046TM
13 14 15 16
001aaa407
R/W H/L
11 12
terminal 1 index area
CD/DVD VDD1 EG
13 14 15
ETST Note
16
1. In test mode all separate satellite signals are available. In normal mode HTST and ETST are high ohmic, FH is the sum of F and H and EG is the sum of E and G.
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Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
8 MODE SELECTION Coder switching PIN LEVEL MODE R/W 6-channel mode don't care LOW LOW LOW LOW LOW HIGH HIGH HIGH HIGH open LOW LOW open HIGH HIGH LOW LOW; open HIGH HIGH LOW LOW HIGH HIGH LOW HIGH LOW HIGH LOW HIGH Power-down writing DVD+R no-clip or averaging mode writing CDR write-clip or sample mode writing CDR no-clip or averaging mode H/L CD/DVD
TZA1046
Table 2
writing DVD+RW no-clip mode; either sampling or averaging mode writing CDRW no-clip mode, either sampling or averaging mode reading DVD+R; DVD-SL reading CD and CDR reading DVD+RW; DVD-DL reading CDRW
8-channel test mode; note 1 test mode LOW LOW; open HIGH HIGH Note 1. The 8-channel test mode is activated when VI(test-on) or II(test-on) is applied to pin R/W or if pin R/W is left open. The values of VI(test-on) or II(test-on) can be found in Chapter 11. 9 MECHANICAL DATA LOW HIGH LOW HIGH reading DVD+R and DVD-SL reading CD and CDR reading DVD+RW and DVD-DL reading CDRW
handbook, full pagewidth
115
50
50
115
E 145
F
A
B
G
H 100
D
C
150 Dimensions in m. Space between central segments: < 1 m. Space between satellite segments: < 1 m.
150
MGU616
Fig.3 Photodiode configuration.
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Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
TZA1046
handbook, full pagewidth
16
15
14
E
13
12
11
10
9
y x + 54 m offset
45 1 see detail X package centre
1
2
3
4
5
6
7
8
MGU617
DETAIL X
45 angle is with respect to the leadframe. Not drawn to scale. Package window is not shown.
Fig.4 Diagram showing position of the photodiode array with respect to the HTSSON16T package (top view).
4.55 0.1 C C 0.3 1.50 min
1.00 min F 3.0 0.12
0 1 rotation tolerance
0.30 0.025
pin 1 mark 0.1
2.275 0.12
0.33 (16x) 0.23
001aaa035
Fig.5 Diagram showing position of the photodiode array with respect to the HTSSON16T package (top view).
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Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
10 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VDD1 VDD2 VDD1 VDD2 Vn PARAMETER supply voltage front-end supply voltage back-end supply voltage difference with respect to VDD2 supply voltage difference with respect to VDD1 voltage at pins A, B, C, D, ETST, FH, EG, HTST, RFP and RFN CD/DVD and H/L R/W -0.3 -0.3 -0.3 VDD2 + 0.3 VDD1 + 0.3 VDD1 + 2.5 MIN. -0.3 -0.3 VDD2 - 0.3 VDD1 - 0.3 MAX. +5.5 +5.5 VDD2 + 0.3 VDD1 + 0.3
TZA1046
UNIT V V V V V V V
11 CHARACTERISTICS VDD1 = VDD2 = 2.0 V; pin R/W = LOW; pin H/L = LOW; pin CD/DVD = HIGH; VA = VB = VC = VD = 2.0 V; VEG = VFH = VETST = VHTST = 2.0 V; VRFP = VRFN = 2.0 V; measured in dark conditions; Tamb = 25 C; 6-channel mode; unless otherwise specified. SYMBOL Supplies VDD1 VDD2 IDD1 supply voltage front-end supply voltage back-end supply current front-end note 1 note 1 dark conditions; 6-channel mode; note 2 writing DVD+R writing CDR clipping writing DVD+RW or CDR no-clip writing CDRW reading DVD reading CD reading DVD+RW reading CDRW power-down mode - - - - - - - - - 13 27 13 12 27 28 27 27 0.4 - - - - - - - - - mA mA mA mA mA mA mA mA mA 4.5 4.5 5.0 5.0 5.5 5.5 V V PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
2004 May 04
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Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
SYMBOL IDD2 PARAMETER supply current back-end CONDITIONS dark conditions; 6-channel mode; note 2 writing DVD+R writing CDR clipping writing DVD+RW or CDR no-clip writing CDRW reading DVD reading CD reading DVD+RW reading CDRW power-down mode Temperature range Tamb B-3dB ambient temperature 0 - 70 - - - - - - - - - 5.3 5.3 5.3 5.3 5.3 5.3 5.3 6.6 0.1 - - - - - - - - - MIN. TYP.
TZA1046
MAX.
UNIT
mA mA mA mA mA mA mA mA mA C
Central segment output channels: pins A, B, C and D bandwidth Io = 1.0 mA writing DVD+R writing CDR clipping writing DVD+RW or CDR no-clip writing CDRW reading DVD reading CD reading DVD+RW reading CDRW td(p) phase delay variation Io = 1mA; fi = 2 to 104 MHz reading DVD reading CD reading DVD+RW reading CDRW Msens Vo Io Io(offset) channel matching sensitivity output voltage range output current output offset current dark conditions; Tamb = 0 to 70 C reading CDRW other modes Io(clip) In(o) output current clipping level spot noise output current CD-R writing; note 4 Io = 1.0 mA; fo = 50 MHz; note 5 reading CD reading DVD+RW reading CDRW 2004 May 04 12 - - - 1.2 0.4 2.0 - - - nA/Hz nA/Hz nA/Hz -14 -14 5 -1.5 -0.9 - +11 +12 8 A A mA note 3 - - - - 0 1 0 0.25 0.15 0.2 0.3 - - - - - - - 5 VDD2 - 1 8 ns ns ns ns % V mA - - - - 130 100 130 80 172 206 211 125 165 142 162 124 - - - - - - - - MHz MHz MHz MHz MHz MHz MHz MHz
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
SYMBOL PARAMETER CONDITIONS MIN. TYP.
TZA1046
MAX.
UNIT
Differential RF outputs channel: pins RFP and RFN B-3dB bandwidth Io = 1.0 mA writing DVD+R writing CDR clipping writing DVD+RW or CDR no-clip writing CDRW reading DVD reading CD reading DVD+RW reading CDRW td(p) phase delay variation Io = 1.0 mA; fi = 2 to 104 MHz reading DVD reading CD reading DVD+RW reading CDRW td(g) group delay variation Io = 1.0 mA; fi = 2 to 104 MHz reading DVD reading CD reading DVD+RW reading CDRW CMR Vo Io Io(offset) common mode ripple output voltage range output current output offset current dark conditions; Tamb = 0 to 70 C pin RFP pin RFN pin RFP; reading CDRW pin RFN; reading CDRW In(o) spot noise output current Io = 1.0 mA; fo = 50 MHz; note 5 reading CD reading DVD+RW reading CDRW - - - 0.9 0.3 1.5 - - - nA/Hz nA/Hz nA/Hz 7 -7 14 -13 22 -20 43 -39 40 -35 79 -70 A A A A Io = 2 mA (peak); fo up to 104 MHz; note 6 - - - - -20 1 0 0.4 0.6 0.4 1 - - - - - - - - VDD2 - 1 8 ns ns ns ns dB V mA - - - - 0.2 0.3 0.25 0.5 - - - - ns ns ns ns - - - - 130 100 130 80 120 205 375 118 175 130 166 114 - - - - - - - - MHz MHz MHz MHz MHz MHz MHz MHz
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Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
SYMBOL PARAMETER CONDITIONS MIN. TYP.
TZA1046
MAX.
UNIT
Satellite segment output channels: pins ETST, FH, EG and HTST; note 7 B-3dB bandwidth Io = 1.0 mA; 6-channel mode writing DVD+R writing CDR clipping writing DVD+RW or CDR no-clip writing CDRW reading DVD reading CD reading DVD+RW reading CDRW Msens Vo Io Io(offset) channel matching sensitivity output voltage range output current output offset current dark conditions; Tamb = 0 to 70 C reading CDRW other modes Io(clip) In(o) current clipping level spot noise output current CD-R writing; note 4 Io = 1.0 mA; fo = 25 MHz; note 5 reading CD reading DVD+RW reading CDRW Settling time, all channels; note 9 tst settling time CD-R write mode; Iset > 300 A; accuracy set level within 5 %; write peak level to set level factor < 50 - - 22 ns - - - 2.2 0.8 4.3 - - - nA/Hz nA/Hz nA/Hz -25 -23 5 -4 -5.4 - 17 12 8 A A mA note 8 - - - - 10 10 10 10 0 1 0 93 81 107 66 75 61 66 56 - - - - - - - - - - - 5 VDD2 - 1 8 MHz MHz MHz MHz MHz MHz MHz MHz % V mA
CD-RW and DVD+RW write modes; - Iset > 100 A; accuracy set level within 5 %; write peak level to set level factor 2; peak current Io(max) DVD+R write mode; Iset > 100 A; accuracy set level within 5 %; write peak level to set level factor 20; peak current Io(max) Control inputs: pins R/W, H/L and CD/DVD VIL VIH ZI(pd) LOW-level input voltage note 10 HIGH-level input voltage pull-down input impedance note 10 only pin CD/DVD 0 2.5 - -
-
10
ns
-
12
ns
- - 200
0.6 VDD1 -
V V k
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Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
SYMBOL PARAMETER CONDITIONS MIN. VDD1 + 2 800 - - TYP.
TZA1046
MAX.
UNIT
Test mode: pin R/W VI(test-on) II(test-on) Sensitivity s Notes 1. The supplies are connected internally by diodes. Differences between the supply voltages should not exceed 0.3 V. 2. Estimated average power consumption (6 channel mode): P = IDD1 x VDD1 + IDD2 x VDD2 + 11/ x I 8 3 o(RF) x VDD2 x K2 - /3 x Io(RF) x Vref + (Io(EG) + Io(FH)) x (VDD2 x K1 - Vref) - 2 x Io(RF)2 x RL2 - 16/9 x Io(RF)2 x RL1 - Io(EG)2 x RL1 - Io(FH)2 x RL1, where: RL2 is the load resistance on each of the differential RF outputs RFP and RFN and RL1 is the load resistance on all other outputs. K1 = 1.35 and K2 = 1.6 for CD-RW reading; K1 = 1.50 and K2 = 1.40 for other modes. Vref = Vref1 = Vref2; see Fig.6. I o(max) - I o(min) 3. Outputs A, B, C, and D: Io = 3 mA output current. Definition of matching: ----------------------------------------------------1 ( I A + I B + I C + I D ) x -4 4. The clipping function is active in the CD-R write mode for the segment outputs (not for outputs RFP and RFN) and in the read mode for all outputs. In the read mode, the clipping level is increased above Io(max). 5. The S/N ratio improves significantly when the sensitivity is lowered. I RFP + I RFN 6. Definition: 20 log ----------------------------I RFP - I RFN 7. In test mode all channels are active, in normal mode channels EG and FH are active and channels ETST and HTST are off. 8. Outputs ETST, FH, EG, and HTST: Io = 1.5 mA output current; Msens = 7 % for reading CD-RW, CD-ROM, DVD+RW and writing CD-R. I o ( max ) - I o ( min ) Definition of matching in normal mode: --------------------------------------1 ( I FH + I EG ) x -2 I o(max) - I o(min) Definition of matching in test mode: ------------------------------------------------------------------------------1 ( I ETST + I FH + I EG + I HTST ) x -4 9. The settling time includes the recovery time. 10. Pins R/W and H/L are three-level switches. When these pins are left open-circuit two internal resistors (150 k to GND and 350 k to VDD) will keep them between 1.3 and 1.7 V. 11. The test mode is also activated when the R/W pin is left open-circuit. 2004 May 04 15 output current sensitivity values depend on operating mode; see Table 3 - - - A/W input voltage to activate note 11 the test mode force current into pin to activate the test mode 8 1200 V A
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
Table 3 Output current sensitivity; typical values
TZA1046
OUTPUT CURRENT SENSITIVITY (A/W)(1) MODE CENTRAL Writing DVD+R with averaging Reading high reflective DVD media: single layer DVD and DVD+R Writing DVD+RW with averaging Reading low reflective DVD media; dual layer DVD and DVD+RW Writing CDR with sampling Reading high reflective CD media Writing CDR with averaging Writing CDRW with averaging Reading low reflective CD media: CDRW Note 1. The sensitivity of the TZA1046 is specified in A/W because it has current outputs. In the application diagram (see Fig.6) the resistors of 150 convert the currents into voltages. The maximum absolute spread is 20 %. 0.72 21.6 2.88 43.2 43.2 86.4 1.44 5.76 173 SATELLITE 1.44 43.2 5.76 86.4 86.4 173 2.88 11.5 346 DIFFERENTIAL (RFP AND RFN) 0.27 8.10 1.08 16.2 1.08 32.4 0.54 2.16 64.8
2004 May 04
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Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
12 APPLICATION AND TEST INFORMATION 12.1 Application example
TZA1046
An application example for the TZA1046 is shown in Fig.6. The satellite segment pins are cross-coupled to be suitable for rewritable applications.
handbook, full pagewidth
VDD
150 ETST EG 16
150 CD/DVD H/L R/W
150
150 HTST FH
15
14
13
12
11
10
9
TZA1046
1 D A 150 Vref1 Vref2
MDB575
2
3
4
5
6
7
8 B C
150
75
75
150
150
RFP
RFN
Fig.6 Application example.
2004 May 04
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Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
12.2 Test mode description
TZA1046
Alignment of the diodes during OPU manufacturing requires the availability of all satellite outputs. In normal mode the F and H channels are combined to a single output FH and the E and G channels are combined to a single output EG. This is done to switch off two channels in the normal mode (application usage) which saves power consumption. For alignment of the diodes each individual satellite output must be available and therefore the TZA1046 can be put in a test mode where all satellite channels are available. The test mode is activated by pulling the R/W digital input pin above the supply (2 to 2.5 V higher than VDD1), by forcing an input current into this pin (800 to 1200 A) or by leaving the pin open-circuit. Fig.7 shows the R/W input configuration.
handbook, full pagewidth
VDD2 VDD1
3 14 6 k 100 300 k
1 k
350 k
1 100 k 1
+1
8-channel test mode +1 1
11 R/W input
1
R/W internal 40 k
150 k GND 6
100 k
MDB576
Fig.7 R/W input configuration.
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Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
13 PACKAGE OUTLINE
HTSSON16T: plastic thermal enhanced thin shrink small outline package/transparent; no leads; 16 terminals; body 6.6 x 5.2 x 1.1 mm
TZA1046
SOT814-1
X D D1 D2 B A
A E2 E1 E c
detail X terminal 1 index area C e1 e b vM C A B wM C y1 C y
1
L
8
terminal 1 index area Eh
16
Dh DIMENSIONS (mm are the original dimensions) UNIT mm A
max.
9
0 2.5 scale D2 min. 1.50 E2 min. 1.00 5 mm
b 0.33 0.23
c 0.5 0.3
D 5.3 5.1
D1 4.5 4.0
Dh 5.15 4.95
E 6.7 6.5
E1 4.2 3.7
Eh 5.4 5.2
e 0.65
e1 4.55
L 0.3
v 0.1
w 0.05
y 0.05
y1 0.1
1.1
OUTLINE VERSION SOT814-1
REFERENCES IEC --JEDEC --JEITA ---
EUROPEAN PROJECTION
ISSUE DATE 03-10-10 03-11-19
2004 May 04
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Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
14 SOLDERING 14.1 Introduction to soldering surface mount packages
TZA1046
To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 14.4 Manual soldering
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. 14.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 270 C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: * below 225 C (SnPb process) or below 245 C (Pb-free process) - for all BGA, HTSSON-T and SSOP-T packages - for packages with a thickness 2.5 mm - for packages with a thickness < 2.5 mm and a volume 350 mm3 so called thick/large packages. * below 240 C (SnPb process) or below 260 C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. 14.3 Wave soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems.
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Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
14.5 Suitability of surface mount IC packages for wave and reflow soldering methods PACKAGE(1) BGA, HTSSON..T(3), LBGA, LFBGA, SQFP, SSOP..T(3), TFBGA, USON, VFBGA DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC(5), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP CWQCCN..L(8), PMFP(9), WQCCN..L(8) Notes not suitable not suitable(4) suitable not not recommended(5)(6) recommended(7)
TZA1046
SOLDERING METHOD WAVE REFLOW(2) suitable suitable suitable suitable suitable not suitable
not suitable
1. For more detailed information on the BGA packages refer to the "(LF)BGA Application Note" (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. 4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 5. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 8. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. 9. Hot bar or manual soldering is suitable for PMFP packages. 15 ADDITIONAL SOLDERING INFORMATION * Reflow peak temperature for TZA1046TM should be no higher than 215 C 5 C. * Manual soldering for TZA1046TM is not encouraged. In case of touch-up desolder the defective device manually and use reflow soldering for the assembly of the replacing device.
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Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
16 DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development DEFINITION
TZA1046
This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
II
Preliminary data Qualification
III
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 17 DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 18 DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2004 May 04
22
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC for CD and DVD applications
ICs with CD functionality Purchase of a Philips IC with CD functionality does not convey an implied license under any patent right to use this IC in any CD application. A license under the Philips CD patents can be obtained via Philips Intellectual Property & Standards (Internet at URL http://www.ip.philips.com; e-mail info.licensing@philips.com).
TZA1046
ICs with DVD functionality Purchase of a Philips IC with DVD functionality does not convey an implied license under any patent right to use this IC in any DVD application. A license under the Philips DVD patents can be obtained via Philips Intellectual Property & Standards (Internet at URL http://www.ip.philips.com; e-mail info.licensing@philips.com).
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Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2004
SCA76
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R04/01/pp24
Date of release: 2004
May 04
Document order number:
9397 750 11525

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